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The International Monetary Fund reviewed the funding of 808.5 million US dollars for Cô te d 'Ivoire, and the Executive Board of the International Monetary Fund has completed the review of its loan arrangement with Cô te d 'Ivoire. The IMF indicated that about $808.5 million could be allocated under the EFF/ECF and RSF arrangements immediately after the review.Xia Yiping, CEO of Extreme Vietnam, was surrounded by employees of Extreme Vietnam in the Shanghai office. On December 12th, Xia Yiping, CEO of Extreme Vietnam, was surrounded by employees of Extreme Vietnam in the Shanghai office. Xia Yiping said: "We are actively solving the problem. I hope everyone will give some time." At present, there are relevant departments at the Shanghai headquarters of Extreme Vietnam to maintain order at the scene. (per meridian)According to the data of Cat's Eye Professional Edition, the movie "Lone Star Project" was released for 6 days, and the total box office broke 70 million.

With a case value of 6.891 billion yuan, the Anti-smuggling Bureau of Huangpu Customs launched a special campaign to crack down on smuggling and fraudulent tax refund, which was announced by the Customs. Recently, the Anti-smuggling Bureau of Huangpu Customs, together with the Third Branch of the Securities Crime Investigation Bureau of the Ministry of Public Security, the Economic Investigation Corps of the Hunan Provincial Public Security Department and the Yueyang Public Security Bureau of Hunan Province, launched a special campaign to crack down on smuggling and fraudulent tax refund, and simultaneously carried out arrests and investigations in Dongguan, Shenzhen, Guangzhou, Yueyang and Jinjiang. After preliminary investigation, criminal gangs were suspected of smuggling imported LCD screens and integrated circuits with a case value of 756 million yuan, falsely issuing special invoices for value-added tax and defrauding export tax rebate of 6.135 billion yuan, with a total case value of 6.891 billion yuan.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Openai: the downtime failures of API, CHATGPT and SORA have been basically fixed. We are monitoring the situation to ensure that the downtime is fully resolved.

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)The Thai government plans to launch digital wallet distribution in 2025.According to the data of Cat's Eye Professional Edition, the movie "Lone Star Project" was released for 6 days, and the total box office broke 70 million.